Benchtop Manual Wafer Thickness Measurement System

  • 产品型号:UMM-BP2
  • 制造原厂:MicroSense, LLC

The UltraMap BP2 system is a patented sensing technology with APBP (dual automated positioning backpressure probes) (20nm resolution).
QA and QC of any type of samples, any shape, any thickness range.R&D labs, thickness control after backgrinding.    


  • Samples 2”to 12”(50 to 300mm)

  • Thickness range: 20um to 5mm

  • Automated calibration

  • All materials, all type of surfaces