Whole wafer geometry measurements - >150,000 data points§
Robust non-contact measurement of filmed wafers. Negligible effects from film composition§
Fast – measure a 200mm wafer in 55 seconds§
Accurate radius of curvature calculation method - calculate radius of curvature from pre- and post-deposition difference map using spherical fit to a surface to generate radius of curvature
High resolution geometry shape data of each wafer is exportable for further analysis§
Capability to correlate data to baseline generated by old legacy systems such as Flexus
More than 100,000 measured points per 6" wafer, with no sacrifice in throughput
Thickness and Global Flatness Measurements - TTV, TIR, FPD
Local Flatness: Local Thickness Variation (LTV), LTIR, LFPD
Bow, Warp and SORI
Throughput - up to 90 6" wafers per hour
0.05 micron thickness repeatability
2D and 3D mapping
